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PCB Electronic Circuit PCB Board Assembly PCBA BOM Processing

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PCB Electronic Circuit PCB Board Assembly PCBA BOM Processing

Brand Name : JIETENG

Model Number : PCBA 0003

Certification : ISO/TS16949/RoHS/TS16949

Place of Origin : Guangdong, China

MOQ : Negotiable

Price : Negotiable

Payment Terms : Negotiable

Supply Ability : 50000 pieces/month

Delivery Time : 5-10 days for delivery

Packaging Details : Outer packing: Standard carton packing,Inner packing:ESD bag.

Min. line spacing : 0.075mm

Surface finishing : Immersion Gold

Type : Lithium Battery BMS

Service : One-stop Service

Name : Multilayer Pcb Design

Item : ODM OEM LED PCBA

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Specializing in the production of PCB high-frequency circuit board PCBA electronic products development BOM processing

Overview
Essential details
Model Number:
Pcba 1002
Type:
Home appliance pcba, Smart Electronic pcba
Place of Origin:
Guangdong, China
Brand Name:
JIETENG
Supplier Type:
PCBA
Copper Thickness:
1/2OZ 1OZ 2OZ 3OZ
Name:
Car GPS Tracker PCBA Manufacturer
Keywords:
One Stop Service Oem Pcb Assembly
Number of Layers:
1,2,4,6,up to 26 layers
Material:
FR-4, glass epoxy, FR4 High Tg, Rohs compliant, Aluminum, Rogers, etc
Application:
Electronics Device
PCB type:
Hard, flexible, rigid-flexible
Shape:
Any shape: Rectangular,round,slots,cutouts,complex,irregular, etc
Board Thickness:
0.4~4.0mm
PCBA service:
SMD SMT DIP Component Assembly
Certificate:
ISO9001/Iso14001/CE/ROHS
PCB Techinecal Capacity
Layers
Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness
Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material
FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing
Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness
UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max. Panel Size
1150mm × 560mm
Aspect Ratio
18:1
Surface Finish
HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and
Resistance control
PCBA technical Capacity
SMT
Position accuracy:20 um
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max. component height::25mm
Max. PCB size:680×500mm
Min. PCB size:no limited
PCB thickness:0.3 to 6mm
PCB weight:3KG
Wave-Solder
Max. PCB width:450mm
Min. PCB width: no limited
Component height:Top 120mm/Bot 15mm
Sweat-Solder
Metal type :part, whole, inlay, sidestep
Metal material:Copper , Aluminum
Surface Finish:plating Au, plating sliver , plating Sn
Press-fit
Air bladder rate:less than 20%
Press range:0-50KN
Max. PCB size:800X600mm
Testing
ICT,Probe flying,burn-in,function test,temperature cycling

PCB Electronic Circuit PCB Board Assembly PCBA BOM Processing


Product Tags:

BOM Processing PCB Board Assembly

      

JETTON PCB Board Assembly

      

PCBA electronic circuit board assembly

      
Quality PCB Electronic Circuit PCB Board Assembly PCBA BOM Processing for sale

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