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FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

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FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

Brand Name : JIETENG

Model Number : FR4

Certification : ISO/TS16949/RoHS/TS16949

Place of Origin : china

MOQ : Negotiable

Price : Negotiable

Payment Terms : Negotiable

Supply Ability : 150000 square meters / year

Delivery Time : 5-8 working day

Packaging Details : Blank carton, vacuum packed

Base material : FR-4

Solder mask : Black Green Blue

Material : Hight TG

Color : green

Plugging vias capability : 0.2-0.8mm

Special requirements : Copper filled vias and supplied stack-up

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FR4 TG180 multilayer printed circuit board immersion gold process

FR4 TG180 is a special type of substrate material used in the manufacture of printed circuit boards (PCBs). It has a glass transition temperature (Tg) of 180°C, indicating that it can withstand high temperatures during operation without losing its mechanical or electrical properties. A multilayer PCB made with FR4 TG180 material refers to a PCB with more than two layers, usually 4 to 16 layers or more. The exact features and specifications of a multilayer FR4 TG180 PCB will depend on the manufacturer, but some common features may include:

Multilayer Count: Multilayer FR4 TG180 PCBs typically have more layers than single or two-layer PCBs, adding functionality and complexity.

High Heat Resistance: FR4 TG180 material has high heat resistance and is suitable for high temperature applications.

Tighter impedance control: Multilayer FR4 TG180 PCBs can have tighter impedance control, which is especially important for high-speed digital and RF applications.

High-frequency performance: FR4 TG180 material has good high-frequency performance and is suitable for occasions requiring high-speed signal transmission.

Smaller via sizes: Multilayer FR4 TG180 PCBs can use smaller via sizes, increasing density and reducing signal interference.

Overall, the multilayer FR4 TG180 PCB is a high performance PCB suitable for a wide range of applications where high temperature, high speed signal transmission and impedance control are important.

PCB Layer Multilayer Printed Circuit board(12L)
PCB surface finished Immersion gold 2u" (0.05 - 0.1 µm gold over 3 - 5 µm of Nickel.) and gold finger
PCB material requirement FR4, TG180
PCB thickness finished 2.2mm finished, +/-10%
Smallest hole size 0.20mm
PCB solder resist 2 sides, blue
PCB silkscreen color 2 sides, white
Copper weigh of outer layer 1 oz (35µm) Finished Copper Weight
Copper weigh of inner layer 1/2 oz (18µm) Base Weight
Special requirements Copper filled vias and supplied stack-up

Shenzhen Jieteng Circuit Co., Ltd.

Professional rapid proofing and multi-variety batch expedited PCB circuit boards

FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process


Product Tags:

TG180 Multilayer Printed Circuit Board

      

Green Multilayer Printed Circuit Board

      

FR4 PCB Board Assembly

      
Quality FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process for sale

FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process Images

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